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MICRF007
PCB Layout Information
The MICRF007 evaluation board was designed and charac-
terized using double sided 0.031 inch thick FR4 material with
1 ounce copper clad. If another type of printed circuit board
material is substituted, impedance matching and character-
ization data may not be as stated in this document.
PCB Silk Screen
PCB Component Side Layout
PCB Solder Side Layout
Micrel
1
2
REFOSC
GND
J2
(np) SMA
ANT1
50? Ant
C3
2.0pF
50V
1
2
U1 MICRF007BM
VSS REFOSC
ANT CAGC
8
7
C1
(np) C AGC
+5V
C2
(np)
J1
(np) CON2
L1
(np)
L2
27nH
+5V
R1
(np)
3
4
VDD
CTH
SHUT
DO
6
5
SH
C4
C AGC
Y1
6.7458MHz
DO
+5V
+5V
GND
DO
SH
1
2
3
4
5
L3
(np) ZCB-0603
+5V
DO
SH
C5
0.1μF
16V
C6
(C TH )
R2
(np)
C7
(np)
R3
100k?
Note:
C TH and C AGC should be
optimized according to data
rate and data format.
(np) = component not placed.
J3
CON5
Figure 11. 433.92MHz Schematic QR007-50-433
M9999-021705
12
February 17, 2005
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